A cured resin product obtained by mixing (A) a compound having an addition-polymerizable group and capable of yielding a thermoplastic resin by its polymerization and (B) a thermosetting resin to form a uniform solution or dispersion and then curing the component (B) while simultaneously polymerizing the component (A), a process for producing the same, a resin composition, and the use of the same.
As compound A olefinically unsaturated monomers like styrene, acrylonitrile or (meth)acrylates, particularly perfluoroalkyl(meth)acrylates, are preferred.
The thermosetting resin is for example a cyanate, maleimide, phenolic or preferably epoxy resin in combination with a suitable curing agent. The compositions are used for water repellent coatings or for sealing semiconductor elements.
将(A)具有可加成聚合基团并能通过聚合生成热塑性
树脂的化合物与(B)热固性
树脂混合形成均匀溶液或分散液,然后在使组分(A)聚合的同时固化组分(B)而得到的固化
树脂产品、生产该产品的工艺、
树脂组合物以及该产品的用途。
化合物 A 首选烯烃不饱和单体,如
苯乙烯、
丙烯腈或(甲基)
丙烯酸酯,特别是
全氟烷基(甲基)
丙烯酸酯。
热固性
树脂可以是
氰酸酯
树脂、马来
酰亚胺树脂、
酚醛
树脂,最好是环氧
树脂,再加上适当的固化剂。这种组合物可用于防
水涂层或密封半导体元件。