Heat resistant polyamides and polybenzoxazoles from bis-[(aminohydroxyphenyl hexafluoro-isopropyl] diphenyl ethers
申请人:HOECHST CELANESE CORPORATION
公开号:EP0317942A2
公开(公告)日:1989-05-31
Heat resistant, shapable, hydroxy and/or alkoxy-substituted polyamides derived from at least one diamine selected from unsubstituted and substituted 4,4'-bis[2-(4-amino- 3-hydroxyphenyl)hexafluoroisopropyl)]diphenyl ether, 4,4'-bis-[2-(3-amino-4-hydroxyphenyl)hexafluoroisopropyl]diphenyl ether and a dicarboxylic acid or a derivative thereof e.g. its acid halo or ester. The polyamides of the application may be thermally cured to form polybenzoxazoles of higher heat resistance which are stable to hydrolytic, chemical and radiation attack.
The polyamides of the application may be formed into shaped articles by molding, extrusion and solvent casting processes preferably in the presence of a solvent or diluent and then optionally converted into heat resistant, insoluble polybenzoxazoles. These shaped articles are useful in aircraft, electronic and other commercial applications where heat, chemical and radiation resistance are desired in conjunction with good mechanical and electrical properties.
耐热、可塑形、羟基和/或烷氧基取代的聚酰胺,由至少一种二胺衍生而成,该二胺选自未取代和取代的 4,4'-双[2-(4-氨基-3-羟基苯基)六氟异丙基)]二苯醚、4,4'-双-[2-(3-氨基-4-羟基苯基)六氟异丙基]二苯醚和二羧酸或其衍生物,例如其酸卤或酯。本申请中的聚酰胺可以通过热固化形成耐热性更高的聚苯并恶唑,这种聚苯并恶唑对水解、化学和辐射侵蚀稳定。
本申请中的聚酰胺可通过模塑、挤压和溶剂浇铸工艺制成定型物品,最好是在有溶剂或稀释剂存在的情况下,然后选择性地转化为耐热、不溶解的聚苯并恶唑。在飞机、电子和其他商业应用中,需要耐热性、耐化学性和耐辐射性,并具有良好的机械和电气性能,这些异型制品非常有用。