2-萘-2-乙酰胺盐酸盐 | 30235-40-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 中文名称: 2-萘-2-乙酰胺盐酸盐
• 英文名称: 2-(2-Naphthyl)acetamidine hydrochloride
• 英文别名: 2-naphthalen-2-ylethanimidamide;hydrochloride
• CAS: 30235-40-6
• 化学式: C12H13ClN2
• 分子量: 220.7
• InChiKey: FPJKHRYOOKUFHF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.74
• 重原子数：
  15
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.08
• 拓扑面积：
  49.9
• 氢给体数：
  3
• 氢受体数：
  1

文献信息

• [EN] SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF<br/>[FR] AGENT DE TRAITEMENT DE SURFACE POUR LE CUIVRE OU UN ALLIAGE DE CUIVRE ET SON UTILISATION
  申请人：SHIKOKU CHEM

  公开号：WO2010024421A1

  公开（公告）日：2010-03-04

  An object is to provide a surface treating agent, which in mounting electronic parts or the like to a printed wiring board using a lead-free solder, forms a chemical layer having excellent heat resistance on the surface of copper or a copper alloy constituting a circuit part of a printed wiring board or the like and at the same time, improves the wettability to the solder and makes the solderability good, and a surface treatment method. Also, another object is to provide a printed wiring board resulting from bringing the surface of copper or a copper alloy constituting a copper circuit part into contact with the foregoing surface treating agent and to provide a soldering method by bringing the surface of copper or a copper alloy into contact with the foregoing surface treating agent and then performing soldering using a lead-free solder. A surface treating agent for copper or a copper alloy, which contains an imidazole compound represented by the formula (I): (I) wherein Ar1 and Ar2 are different and represent the following formula (II) or formula (III); R represents a hydrogen atom or an alkyl group: (II) (III) wherein X1 and X2 are the same or different and represent a hydrogen atom or a chlorine atom.