2.3-Bis-<4-hydroxy-phenyl>-butan | 4732-08-5

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二苯乙烯类
• 英文名称: 2.3-Bis-<4-hydroxy-phenyl>-butan
• 英文别名: meso-2,3-Bis-(p-hydroxyphenyl)-butan；2,3-Di-(4-hydroxyphenyl)butan；4,4-Butane-2,3-diyldiphenol, 8；4-[3-(4-hydroxyphenyl)butan-2-yl]phenol
• CAS: 4732-08-5
• 化学式: C₁₆H₁₈O₂
• 分子量: 242.318
• InChiKey: GDUYFVYTXYOMSJ-UHFFFAOYSA-N

物化性质

• 熔点：
  230 °C
• 沸点：
  372.2±22.0 °C(Predicted)
• 密度：
  1.130±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  4.1
• 重原子数：
  18
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  40.5
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  4-乙基苯酚 以 乙腈 为溶剂， 反应 24.0h， 生成 2.3-Bis-<4-hydroxy-phenyl>-butan
  参考文献：
  名称：

  木质素油光催化升级柴油前驱体和氢气

  摘要：

  从生物质中生产可再生生物燃料是满足未来能源需求的一种很有前景的方式。在这里，我们通过木质素油的二聚化和加氢脱氧展示了木质素到柴油的路线。在可见光照射下，木质素油在 Au/CdS 光催化剂上发生 C-C 键脱氢偶联，共同产生柴油前体和氢气。负载在 CdS 上的 Au 纳米粒子可以有效抑制光生电子和空穴的复合，从而提高二聚反应的效率。大约 2.4 mmol g catal -1  h -1二聚体和 1.6 mmol g catal -1  h -1 H 2是在 Au/CdS 上产生的，分别是 CdS 的 12 倍和 6.5 倍。柴油前体最终分别通过使用 Pd/C 或多孔 CoMoS 催化剂的加氢脱氧反应转化为 C16-C18 环烷烃或芳烃。将松木屑转化为柴油是为了证明木质素到柴油路线的可行性。

  DOI：

  10.1002/anie.202105692

文献信息

• Compounds, compositions and methods for the treatment of synucleinopathies
  申请人：Esposito Luke

  公开号：US20070276034A1

  公开（公告）日：2007-11-29

  Bis- and tris-dihydroxyaryl compounds and their methylenedioxy analogs and pharmaceutically acceptable esters, their synthesis, pharmaceutical compositions containing them, and their use in the treatment of synucleinopathies, such as Parkinson's disease, and the manufacture of medicaments for such treatment.

  双-和三-二羟基芳基化合物及其亚甲二氧基类似物和药学上可接受的酯，它们的合成，含有它们的制药组合物，以及它们在治疗突触核病，如帕金森病中的应用和制造用于这种治疗的药物。
• PROCESS FOR PRODUCING POLYCARBONATE POWDER
  申请人：IDEMITSU PETROCHEMICAL CO., LTD.

  公开号：EP0616002A1

  公开（公告）日：1994-09-21

  A process for producing polycarbonate powder readily by ejecting a mixture of a solution of polycarbonate in an organic solvent with steam through a mixing nozzle, wherein a lowness of the bulk density of the powder, which has been a shortcoming of the conventional processes using a mixing nozzle, can be remedied without causing any increase in the amount of a residual solvent by using a 3-45 wt.% solution of polycarbonate in an organic solvent and adjusting the ratio of the weight (Ws) of the steam to the weight (Wo) of the organic solvent in the solution to 1/10 to 1/5.

  一种通过混合喷嘴喷射聚碳酸酯在有机溶剂中的溶液与蒸汽的混合物，从而轻松生产聚碳酸酯粉末的工艺，其中，粉末体积密度低一直是使用混合喷嘴的传统工艺的缺点，通过使用重量百分比为 3-45% 的聚碳酸酯在有机溶剂中的溶液，并将蒸汽重量（Ws）与溶液中有机溶剂重量（Wo）之比调整为 1/10 至 1/5，可在不增加残留溶剂量的情况下解决这一问题。%的聚碳酸酯溶液，并将溶液中蒸汽重量（Ws）与有机溶剂重量（Wo）之比调整为 1/10 至 1/5。
• COPOLYETHERIMIDES
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1660556A1

  公开（公告）日：2006-05-31
• Solid Polymer Electrolyte Composition, and Ion-Exchange Membrane, Membrane Electrode Assembly and Fuel Cell
  申请人：Akashi Mayumi

  公开号：US20120107725A1

  公开（公告）日：2012-05-03

  To provide a solid polymer electrolyte composition that can improve oxidation resistance without causing decrease in proton conductivity, elution of added components and the like, and an ion-exchange membrane, a membrane electrode assembly and a fuel cell, each using the composition. It is possible to obtain a solid polymer electrolyte composition having excellent oxidation resistance without causing decrease in proton conductivity, elution of added components and the like, by mixing an aromatic hydrocarbon-based polymer electrolyte, a phosphorus-containing polymer compound and a metallic element.
• EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD
  申请人：Iwami Tomoaki

  公开号：US20130096233A1

  公开（公告）日：2013-04-18

  The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.