申请人:DIC Corporation
公开号:US20200207700A1
公开(公告)日:2020-07-02
The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1):
(where in chemical formula (1), Ar
1
is a substituted or unsubstituted first aromatic ring group, and each Ar
2
is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar
1
and Ar
2
has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.
本发明旨在提供一种手段,通过该手段可以获得具有低介电损耗正切和更高耐热性的固化产品。具体地,提供了一种由化学式(1)表示的活性酯化合物:(其中,在化学式(1)中,Ar1是取代或未取代的第一芳香环基团,每个Ar2独立地是取代或未取代的第二芳香环基团,其中至少一个Ar1和Ar2具有含有不饱和键的取代基,n是2或3的整数),以及包含活性酯化合物的可固化组合物和其固化产物。