Method of forming pattern, method of manufacturing semiconductor device, and pattern-forming material
申请人:Kioxia Corporation
公开号:US11410848B2
公开(公告)日:2022-08-09
A method of forming a pattern of an embodiment includes: forming an etch mask on a film to be processed by using a pattern-forming material containing an organic polymer; and patterning the etch mask. In the method of the embodiment, the organic polymer contains 70 atom % or more carbon atoms having an sp2 orbital and 5 atom % or more carbon atoms having an sp3 orbital among the carbon atoms constituting the organic polymer. The patterned etch mask is used for etching of the film to be processed with a gas containing a fluorine atom.
一种形成实施例图案的方法包括:使用含有有机聚合物的图案形成材料在待处理薄膜上形成蚀刻掩膜;以及对蚀刻掩膜进行图案化。在本实施例的方法中,有机聚合物包含 70 个或更多具有 sp2 轨道的碳原子和 5 个或更多具有 sp3 轨道的碳原子。图案化蚀刻掩膜用于用含氟原子的气体蚀刻待处理薄膜。