申请人:ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
公开号:US20200209746A1
公开(公告)日:2020-07-02
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. In the composition, the developability (i.e., development rate) is appropriately adjusted by the interaction between the photoactive compound of a polymer, and/or the photoactive compound of a monomer, containing a repeat unit having a specific structure and the two kinds of a binder resin (i.e., a siloxane copolymer and an acrylic copolymer). Thus, it is possible to reduce the rate of loss in the thickness of a cured film during the development step. In addition, the use of the composition allows an increase in the exposed portion (i.e., the portion exposed to light) by the interaction between the two kinds of a binder resin and the photoactive compound, which increases the solubility in a developer, whereby the sensitivity can be enhanced. Further, the composition is capable of forming a cured film that is excellent in film retention rate and has a smooth surface even upon the post-bake.