THERMALLY STABLE LOW DIELECTRIC NORBORNENE POLYMERS WITH IMPROVED SOLUBILITY AND ADHESION PROPERTY
申请人:Lee Kyu Jin
公开号:US20070255031A1
公开(公告)日:2007-11-01
The present invention provides norbornene-based copolymers for which one monomer is at least selected from a group consisting of norbornene and dicyclopentadiene, and the other from norbornene-based comonomers of Formula 1 shown below:
In Formula 1, R
1
, R
2
and a are defined in this specification. The present invention provides insulating elements for multi-chip packages and antireflection films for the exposure process of semiconductor fabrication using said norbornene-based copolymers. Norbornene-based copolymers according to the present invention have low dielectric constant as well as high thermal stability and excellent solubility to various organic solvents.