A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.
一种用于处理
铜和
铜合
金表面的组合物,由特定的
咪唑衍
生物和
水、酸或
水溶性溶剂组成。当该组合物用于
铜或
铜合
金表面时,可产生一层耐热的有机薄膜,具有极佳的可焊性。作为印刷线路板的防锈剂,它尤其有用。