申请人:Yutaka Kie
公开号:US20140005353A1
公开(公告)日:2014-01-02
Provided is a polyamide compound containing a plant-derived component which has high heat resistance and good moldability. The polyamide compound is represented by the following general formula (1) and has a weight-average molecular weight of 5,000 or more and 200,000 or less:
in the formula (1), m represents 2 or 3, and each end of the polymer is one of a hydroxyl group and hydrogen.