The preset invention provides a curable resin composition which causes little change in heat resistance after a heat history of cured products and exhibits low thermal expandability, and also provides a cured product of the curable resin composition, a printed circuit board causing little change in heat resistance after a heat history and having excellent low thermal expandability, and an epoxy resin having these performances. The epoxy resin is produced by polyglycidyl-etherification of a reaction product of para-cresol, a β-naphthol compound, and formaldehyde, the epoxy resin containing a trifunctional compound (x) represented by a structural formula (1) below and a dimer (y) represented by a structural formula (2) below, and the content of the trifunctional compound (x) is 55% or more in terms of ratio by area in GPC measurement.
                            该预设发明提供了一种可固化
树脂组合物,其在固化产品的热历史后热阻变化较小,且具有低热膨胀性,同时还提供了该可固化
树脂组合物的固化产品、热历史后热阻变化较小且具有优异低热膨胀性的印刷电路板以及具有这些性能的环氧
树脂。该环氧
树脂是通过对
对甲酚、β-
萘酚化合物和
甲醛的反应产物进行聚环氧
丙烷化而生产的,该环氧
树脂含有下式(1)所表示的三官能化合物(x)和下式(2)所表示的二聚体(y),其中三官能化合物(x)的含量在
GPC测量中按面积比为55%或更高。