A semiconductor photoresist composition includes an organotin compound represented by Chemical Formula 1, and a solvent. A method for preparing the same, and a method of forming patterns utilizing the same are disclosed.
Specific details of Chemical Formula 1 are as defined in the specification.
一种半导体光刻胶组合物,包括由
化学式1表示的
有机锡化合物和溶剂。公开了制备该组合物的方法以及利用该组合物形成图案的方法。
化学式1的具体细节在规范中定义。