The invention provides a method of forming an insulating film which exhibits resistance against processing such as RIE used when forming a dual-damascene structure while maintaining a low relative dielectric constant of a polysiloxane insulating film. A polysiloxane insulating film is formed on a substrate by hydrolysis and condensation of a silane compound. A solution obtained by dissolving a polycarbosilane compound shown by the following general formula in a solvent is applied to the polysiloxane insulating film, and the resulting coating is heated to form a polycarbosilane insulating film.
An organic insulating film is then formed on the polycarbosilane insulating film.
本发明提供了一种形成绝缘膜的方法,这种绝缘膜既能抵抗在形成双大马士革结构时使用的 RIE 等加工,又能保持聚
硅氧烷绝缘膜较低的相对介电常数。聚
硅氧烷绝缘膜是通过
硅烷化合物的
水解和缩合作用在基材上形成的。将下表通式所示的聚碳
硅烷化合物溶解在溶剂中得到的溶液涂抹在聚
硅氧烷绝缘膜上,然后加热涂层,形成聚碳
硅烷绝缘膜。
然后在聚碳
硅烷绝缘膜上形成有机绝缘膜。