2-Nitro-naphthalin-sulfonsaeure-(4) | 102653-24-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 2-Nitro-naphthalin-sulfonsaeure-(4)
• 英文别名: 3-Nitronaphthalene-1-sulfonic acid
• CAS: 102653-24-7
• 化学式: C₁₀H₇NO₅S
• 分子量: 253.235
• InChiKey: UEUHJXHNSYNMHS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  17
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  109
• 氢给体数：
  1
• 氢受体数：
  5

文献信息

• CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
  申请人：Carter K. Melvin

  公开号：US20050090109A1

  公开（公告）日：2005-04-28

  The invention relates to chemical mechanical polishing of substrates using an abrasive and a fluid composition, wherein certain organosulfonic acid compounds are used as oxidizers, and particularly relates to a method of polishing substrates comprising copper, tungsten, titanium, and/or polysilicon using a chemical-mechanical polishing system comprising organosulfonic acids having an electrochemical oxidation potential greater than 0.2V as an oxidizer.

  本发明涉及使用磨料和流体组合物对基底进行化学机械抛光，其中使用某些有机磺酸化合物作为氧化剂，特别是涉及一种使用化学机械抛光系统对由铜、钨、钛和/或多晶硅组成的基底进行抛光的方法，该系统包含电化学氧化电位大于 0.2V 的有机磺酸作为氧化剂。
• CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
  申请人：Compton Frederick Timothy

  公开号：US20070054495A1

  公开（公告）日：2007-03-08

  A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a boron surface-modified abrasive, a nitro-substituted sulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords high removal rates for barrier layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., step 2 copper CMP processes).
• US7247566B2
  申请人：——

  公开号：US7247566B2

  公开（公告）日：2007-07-24
• US7678702B2
  申请人：——

  公开号：US7678702B2

  公开（公告）日：2010-03-16