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Iodonium, bis[(1,1-dimethylethyl)phenyl]-, salt with perfluorohexanesulfonic acid (1:1) | 866621-50-3

中文名称
——
中文别名
——
英文名称
Iodonium, bis[(1,1-dimethylethyl)phenyl]-, salt with perfluorohexanesulfonic acid (1:1)
英文别名
bis(2-tert-butylphenyl)iodanium;1,1,2,2,3,3,4,4,5,5,6,6,6-tridecafluorohexane-1-sulfonate
Iodonium, bis[(1,1-dimethylethyl)phenyl]-, salt with perfluorohexanesulfonic acid (1:1)化学式
CAS
866621-50-3
化学式
C26H26F13IO3S
mdl
——
分子量
792.4
InChiKey
JGBDZZPDMXIDQM-UHFFFAOYSA-M
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    5.64
  • 重原子数:
    44
  • 可旋转键数:
    8
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.54
  • 拓扑面积:
    65.6
  • 氢给体数:
    0
  • 氢受体数:
    16

文献信息

  • Negative resist composition with fluorosulfonamide-containing polymer
    申请人:Li Wenjie
    公开号:US20050058930A1
    公开(公告)日:2005-03-17
    A negative resist composition is disclosed, wherein the resist composition includes a polymer having at least one fluorosulfonamide monomer unit having one of the following two formulae: wherein: M is a polymerizable backbone moiety; Z is a linking moiety selected from the group consisting of —C(O)O—, —C(O)—, —OC(O)—, —O—C(O)—C(O)—O—, or alkyl; P is 0 or 1; R 1 is a linear or branched alkyl group of 1 to 20 carbons; R 2 is hydrogen, fluorine, a linear or branched alkyl group of 1 to 6 carbons, or a semi- or perfluorinated linear or branched alkyl group of 1 to 6 carbons; and n is an integer from 1 to 6. A method of forming a patterned material layer on a substrate is also disclosed, wherein the method includes applying the fluorosulfonamide-containing resist composition to the substrate to form a resist layer on the material layer; patternwise exposing the resist layer to imaging radiation; removing portions of the resist layer not exposed to the imaging radiation to create spaces in the resist layer corresponding to the pattern; and removing portions of the material layer at the spaces formed in the resist layer, thereby forming a patterned material layer.
    本发明公开了一种负型光刻胶组合物,其中所述光刻胶组合物包括具有至少一个磺酰胺单体单元的聚合物,其具有以下两种式之一: 其中:M是可聚合的骨架基团;Z是选择自—C(O)O—、—C(O)—、—OC(O)—、—O—C(O)—C(O)—O—或烷基的连接基团;P为0或1;R1是1至20个碳的线性或支链烷基;R2是氢、、1至6个碳的线性或支链烷基,或1至6个碳的半全氟线性或支链烷基;n是1至6的整数。本发明还公开了一种在基板上形成图案材料层的方法,其中该方法包括将含有磺酰胺的光刻胶组合物应用于基板上,以在材料层上形成光刻胶层;将光刻胶层按图案暴露于成像辐射;去除未暴露于成像辐射的光刻胶层部分,以在光刻胶层中形成与图案相对应的空间;并去除在光刻胶层中形成的空间处的材料层部分,从而形成图案化的材料层。
  • DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITION AND PATTERN FORMING METHOD USING THEREOF
    申请人:International Business Machines Corporation
    公开号:US20150050601A1
    公开(公告)日:2015-02-19
    The present invention relates to a developable bottom antireflective coating (BARC) composition and a pattern forming method using the BARC composition. The BARC composition includes a first polymer having a first carboxylic acid moiety, a hydroxy-containing alicyclic moiety, and a first chromophore moiety; a second polymer having a second carboxylic acid moiety, a hydroxy-containing acyclic moiety, and a second chromophore moiety; a crosslinking agent; and a radiation sensitive acid generator. The first and second chromophore moieties each absorb light at a wavelength from 100 nm to 400 nm. In the patterning forming method, a photoresist layer is formed over a BARC layer of the BARC composition. After exposure, unexposed regions of the photoresist layer and the BARC layer are selectively removed by a developer to form a patterned structure in the photoresist layer. The BARC composition and the pattern forming method are especially useful for implanting levels.
    本发明涉及一种可开发的底部抗反射涂层(BARC)组合物及使用该BARC组合物的图案形成方法。该BARC组合物包括第一聚合物,其具有第一羧基酸基团,含羟基的脂环族基团和第一色团基团;第二聚合物,其具有第二羧基酸基团,含羟基的非环族基团和第二色团基团;交联剂;以及辐射敏感的酸发生剂。第一和第二色团基团吸收100纳米至400纳米波长的光线。在图案形成方法中,先形成一层BARC组合物的BARC层,再在其上形成一层光阻层。经曝光后,通过显影剂选择性地去除光阻层和BARC层的未曝光区域,形成光阻层中的图案结构。该BARC组合物和图案形成方法特别适用于植入级别。
  • Fluorinated photoresist materials with improved etch resistant properties
    申请人:Khojasteh Mahmoud
    公开号:US20060105269A1
    公开(公告)日:2006-05-18
    A photoresist composition including a polymer is disclosed, wherein the polymer includes at least one monomer having the formula: where R 1 represents hydrogen (H), a linear, branched or cyclo alkyl group of 1 to 20 carbons, a semi- or perfluorinated linear, branched or cyclo alkyl group of 1 to 20 carbons or CN; R 2 represents an alicyclic group of 5 or more carbon atoms; X represents a methylene, ether, ester, amide or carbonate linkage; R 3 represents a linear or branched alkylene group or semi- or perfluorinated linear or branched alkylene group with 1 or more carbon atoms; R 4 represents hydrogen (H), methyl (CH 3 ), trifluoromethyl (CF 3 ), difluoromethyl (CHF 2 ), fluoromethyl (CH 2 F), or a semi- or perflourinated aliphatic group; R 5 represents trifluoromethyl (CF 3 ), difluoromethyl (CHF 2 ), fluoromethyl (CH 2 F), or a semi- or perfluorinated substituted or unsubstituted aliphatic group; n represents an integer of 1 or more; and OR 12 represents OH or at least one acid labile group selected from a tertiary alkyl carbonate, a tertiary alkyl ester, a tertiary alkyl ether, an acetal and a ketal. A method of patterning a substrate is also disclosed, wherein the method includes: applying the photoresist composition mentioned above to the substrate to form a film; patternwise exposing the film to an imaging radiation source; and developing areas of the film to form a patterned substrate.
    本发明公开了一种包括聚合物的光刻胶组合物,其中聚合物包括至少一种具有以下式子的单体: 式中 R 1 代表氢(H),1-20 个碳原子的直链、支链或环烷基,1-20 个碳原子的半全氟直链、支链或环烷基或 CN; R 2 2 代表 5 个或更多碳原子的脂环族基团; X 代表亚甲基、醚、酯、酰胺或碳酸酯链节; R 3 代表具有 1 个或多个碳原子的直链或支链亚烷基或半全氟直链或支链亚烷基; R 4 代表氢(H)、甲基(CH 3 )、三甲基(CF 3 )、二甲基(CHF 2 )、甲基(CH 2 F)或半化或全氟化脂肪族基团; R 5 代表三甲基 (CF 3 )、二甲基(CHF 2 )、甲基(CH 2 F),或半全氟取代或未取代的脂肪族基团; n 代表 1 个或多个整数;以及 OR 12 代表 OH 或至少一个选自碳酸叔烷基酯、叔烷基酯、叔烷基醚、缩醛缩酮的酸性基团。本发明还公开了一种将基底图案化的方法,其中该方法包括:将上述光致抗蚀剂组合物涂在基底上以形成胶片;将胶片图案化地暴露于成像辐射源;以及显影胶片的区域以形成图案化的基底。
  • NEGATIVE RESIST COMPOSITION WITH FLUOROSULFONAMIDE-CONTAINING POLYMER
    申请人:International Business Machines Corporation
    公开号:EP1664923A1
    公开(公告)日:2006-06-07
  • EP1664923A4
    申请人:——
    公开号:EP1664923A4
    公开(公告)日:2008-08-27
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