2,3-bis(methoxymethyl)naphthalene | 65553-66-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 2,3-bis(methoxymethyl)naphthalene
• 英文别名: 2,3-Bis-methoxymethyl-naphthalin
• CAS: 65553-66-4
• 化学式: C₁₄H₁₆O₂
• 分子量: 216.28
• InChiKey: YXWLHLNBGSDZEL-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  16
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.29
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  邻二氯苄 、 1,4-二甲氧基-2-丁炔 在 锰 、 三[3,4-双(三氟甲基)苯基]膦 、 cobalt(II) bromide 作用下， 以 乙腈 为溶剂， 反应 20.0h， 生成 2,3-bis(methoxymethyl)naphthalene 、 2,3-bis(methoxymethyl)-1,4-dihydronaphthalene
  参考文献：
  名称：

  钴催化的α，α'-二氯邻二甲苯与炔烃的形式[4 + 2]环加成

  摘要：

  使用低价钴催化剂开发了α，α′-二氯邻二甲苯与各种炔烃的正式[4 + 2]环加成反应。该转化具有广泛的底物范围和较高的官能团耐受性，并导致了1,4-二氢萘。形成的环加合物很容易在空气中被MnO 2芳香化。机理研究表明，该转化过程是通过炔烃的苄基钴化反应完成的，而不是邻喹啉二甲烷的经典Diels-Alder反应。这种方法为线性扩展的π共轭芳族化合物提供了一种简单，流线型的访问方法。

  DOI：

  10.1002/anie.201406807

文献信息

• Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US10831101B2

  公开（公告）日：2020-11-10

  A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.

  一种光敏树脂组合物含有一种树脂和一种化合物，每种树脂和化合物都具有本说明书规定的结构，这种组合物提供的固化薄膜对铜线具有极佳的粘合性。
• Resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US10990008B2

  公开（公告）日：2021-04-27

  The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.

  本发明提供了一种树脂组合物，即使在低温下进行热处理，也能形成具有耐化学性、低应力特性和高伸长特性的固化膜。 该树脂组合物包括碱溶性树脂 (a)，它含有具有交联基团的苯酚骨架和不具有交联基团的苯酚骨架，其重量平均分子量在 1,000 至 50,000 之间，其中具有交联基团的苯酚骨架与具有交联基团的苯酚骨架和不具有交联基团的苯酚骨架的结构单元总数的 100%（以摩尔计）的含量比在 5 至 90%（以摩尔计）之间。
• RESIN COMPOSITION
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20190086800A1

  公开（公告）日：2019-03-21

  The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature. The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
• PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS
  申请人：ASAHI KASEI KABUSHIKI KAISHA

  公开号：US20190113845A1

  公开（公告）日：2019-04-18

  A photosensitive resin composition containing a resin and a compound each having a structure specified by the present specification provides a cured film having excellent adhesiveness to copper wiring.