二烯丙酯异氰尿酸 | 1081-69-2

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 中文名称: 二烯丙酯异氰尿酸
• 英文名称: 4,6-bis-allyloxy-1H-[1,3,5]triazin-2-one
• 英文别名: 4,6-bis(prop-2-enoxy)-1H-1,3,5-triazin-2-one
• CAS: 1081-69-2
• 化学式: C₉H₁₁N₃O₃
• mdl: MFCD24393338
• 分子量: 209.205
• InChiKey: VSZARHUCMHICLD-UHFFFAOYSA-N

物化性质

• 熔点：
  148 °C
• 沸点：
  256.5±43.0 °C(Predicted)
• 密度：
  1.21±0.1 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.4
• 重原子数：
  15
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.222
• 拓扑面积：
  72.3
• 氢给体数：
  1
• 氢受体数：
  3

安全信息

• 海关编码：
  2933699090

反应信息

• 作为产物：
  描述：

  2,4,6-三烯丙氧基-1,3,5-三嗪 在 四甲基氢氧化铵 作用下， 以 正己烷 为溶剂， 以60 %的产率得到二烯丙酯异氰尿酸
  参考文献：
  名称：

  Ag/氰尿酸盐/膦金属大环单分子层通过原位配体酯交换保护具有热激活延迟荧光的 Ag22 纳米团簇

  摘要：

  通过原位配体形成策略，以高产率合成了四个由金属大环单层保护的同构 Ag 22纳米团簇。高电子亲和性三嗪基氰脲酸酯配体赋予团簇独特的核-壳界面键合结构和供体-受体型电子结构，形成第一个具有热激活延迟荧光（TADF）特性的混合价Ag 0/I纳米团簇.

  DOI：

  10.1002/anie.202211628

文献信息

• SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND
  申请人：DIC CORPORATION

  公开号：US20200325101A1

  公开（公告）日：2020-10-15

  Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

  亚苯基马来酰亚胺化合物，具有三个或更多苯环的结构，含有一个或多个取代或未取代的烯丙基团，以及一个或多个马来酰亚胺基团，具有卓越的耐热性。
• Polyether, active-hydrogen ingredient , resin-forming composition, and process for producing foam
  申请人：——

  公开号：US20030100623A1

  公开（公告）日：2003-05-29

  The present invention relates to polyether compounds, active hydrogen compounds and resin-forming compositions composed of the polyols, and methods for producing foams by employing the active hydrogen components. These polyether compounds have a decreased number of moles of added EO thereby maintaining the hydrophobicity and have sufficient reactivity as polyol components of resins, thereby having high reaction rates. Therefore, it is possible to provide resins having excellent resin properties (tensile strength, flexural strength, water-absorption swelling ratio, etc.).

  本发明涉及聚醚化合物、活性氢化合物和由聚醚醇组成的树脂成型组合物，以及通过使用活性氢成分制备泡沫的方法。这些聚醚化合物具有降低的EO加入摩尔数，从而保持疏水性，并具有足够的反应性作为树脂的聚醇组分，因此具有高反应速率。因此，可以提供具有优异树脂性能（拉伸强度、弯曲强度、吸水膨胀率等）的树脂。
• ELECTROCHROMIC MATERIAL
  申请人：Nagamura Toshihiko

  公开号：US20110149367A1

  公开（公告）日：2011-06-23

  The present invention relates to an electrochromic polymer compound composed of a hyperbranched polymer having electrochromic characteristics derived from a quaternary pyridinium salt, a terephthalic acid diester or a biphenyl-4,4′-diester structure, and a varnish, a thin film structure and an electrochromic device that are obtained by the polymer compound. The electrochromic material has high response speed, high coloring efficiency, and excellent repetition stability and can be used for a long time, and has excellent solubility in various solvents.

  本发明涉及一种电致变色聚合物化合物，由四级吡啶盐、对苯二甲酸二酯或联苯-4,4'-二酯结构的超支化聚合物具有电致变色特性，以及所得到的清漆、薄膜结构和电致变色装置。该电致变色材料具有高响应速度、高着色效率和优异的重复稳定性，可长时间使用，并在各种溶剂中具有优异的溶解性。
• NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF
  申请人：Fujihara Kan

  公开号：US20100132989A1

  公开（公告）日：2010-06-03

  An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound.

  本发明的目的是提供一种聚酰亚胺前体组成物溶液，其(i)不使用硅氧烷二胺，(ii)可在低温（不超过250℃）下固化，且(iii)具有低粘度，无论其浓度如何，并提供一种光敏树脂组成物、光敏树脂膜、热固性树脂组成物、聚酰亚胺绝缘膜以及带有绝缘膜的印制电路板，每种产品都具有良好的物理性能，并通过使用聚酰亚胺前体组成物溶液获得。通过使用聚酰亚胺前体组成物溶液，该溶液至少包括(A)具有端羧基的聚氨酯酰亚胺寡聚体和(B)二胺化合物和/或异氰酸酯化合物，从而实现了上述目的。
• NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF
  申请人：Sekito Yoshihide

  公开号：US20140069702A1

  公开（公告）日：2014-03-13

  The photosensitive resin composition contains a (A) binder polymer, (B) cross-linked polymer particles, (C) thermosetting resin, (D) photo-polymerization initiator, and a (E) phosphoric flame retardant, in which a content of the (B) cross-linked polymer particles is 30 parts by weight to 100 parts by weight with respect to the 100 parts by weight of the (A) binder polymer, and an average particle diameter of the (B) cross-linked polymer particles is 1 μm to 10 μm. Therefore, the photosensitive resin composition (i) obtains an excellent tack-free property after being applied and dried, (ii) can be subjected to fine processing, (iii) is formed into a cured film having excellent flexibility, flame retardancy, and electrical insulation reliability, and (iv) causes a substrate to have a small warpage after being cured.

  这种光敏树脂组合物包含(A)粘合剂聚合物、(B)交联聚合物微粒、(C)热固性树脂、(D)光聚合引发剂和(E)磷酸盐阻燃剂，其中(B)交联聚合物微粒的含量相对于(A)粘合剂聚合物的100重量份为30重量份到100重量份，并且(B)交联聚合物微粒的平均粒径为1微米到10微米。因此，这种光敏树脂组合物(i)在涂抹和干燥后获得出色的不粘性能，(ii)可以进行精细加工，(iii)形成具有出色的柔韧性、阻燃性和电气绝缘可靠性的固化膜，(iv)使基板在固化后具有较小的翘曲。