EPOXY COMPOUND, CURABLE COMPOSITION, AND CURED PRODUCT THEREOF
申请人:DIC Corporation
公开号:EP2557103A1
公开(公告)日:2013-02-13
A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).
The alkylation of phenol derivatives can be achieved in good yield via Lewis or Brønsted acid. The only by-product of the reaction is water and the catalyst can be recycled when using Brønsted acid.