2-(diphenylphosphoryl)-1,4-naphthoquinone | 131523-66-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 2-(diphenylphosphoryl)-1,4-naphthoquinone
• 英文别名: 2-Diphenylphosphorylnaphthalene-1,4-dione
• CAS: 131523-66-5
• 化学式: C₂₂H₁₅O₃P
• 分子量: 358.333
• InChiKey: FEYSBSJNCSKHJC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.8
• 重原子数：
  26
• 可旋转键数：
  3
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  51.2
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  (2,7-dihydroxynaphthyl)diphenylphosphine oxide 在 potassium nitrososulfonate 作用下， 以 乙醇 、 水 为溶剂， 反应 0.17h， 以74%的产率得到2-(diphenylphosphoryl)-1,4-naphthoquinone
  参考文献：
  名称：

  Kutyrev, A. A.; Lebedeva, O. E.; Moskva, V. V., Journal of general chemistry of the USSR, 1990, vol. 60, # 7.2, p. 1486 - 1487

  摘要：

  DOI：

文献信息

• NOVEL PHOSPHORUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION ESSENTIALLY CONTAINING THE EPOXY RESIN, AND CURED PRODUCT OF THE EPOXY RESIN COMPOSITION
  申请人：Tohto Kasei Co., Ltd.

  公开号：EP2123688A1

  公开（公告）日：2009-11-25

  Disclosed is a novel phosphorous containing epoxy resin having a naphthalene skeletal represented by represented by following general formula (1), a is 1, 2, 3, 4, 5 or 6; b is 1, 2, 3, 4, 5, 6 or 7; c is 0, 1, 2, 3 or more; X represents benzene, naphthalene, anthracene, phenanthrene or biphenyl; and Y represents, for example, a group represented by following general formula (3). In formula (3), d is 0 or 1; and R1 and R2 represent a straight chain, branched or cyclic hydrocarbon group, or alternatively, R1 and R2 may combine together to form a ring structure. This epoxy resin is suitable for an insulating material such as a copper-clad laminate used in an electronic circuit board and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material as material for an electrically insulating coating.

  本发明公开了一种新型含磷环氧树脂，其萘骨架由以下通式（1）表示：a 是 1、2、3、4、5 或 6；b 是 1、2、3、4、5、6 或 7；c 是 0、1、2、3 或更多；X 代表苯、萘、蒽、菲或联苯；Y 代表例如由以下通式（3）表示的基团。在式 (3) 中，d 为 0 或 1；R1 和 R2 代表直链、支链或环状烃基，或者 R1 和 R2 可结合在一起形成环状结构。这种环氧树脂适用于绝缘材料，如电子电路板中使用的覆铜板，以及电气元件中使用的密封材料、成型材料、浇铸材料、粘合剂或薄膜材料。此外，这种环氧树脂还适合用作电绝缘涂层材料。
• Phosphorus-containing polyphenylene oxide resin, its preparation method, method for preparing prepolymer of phosphorus-containing polyphenylene oxide, resin composition and its application
  申请人：Elite Material Co., Ltd.

  公开号：US10280260B2

  公开（公告）日：2019-05-07

  The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

  本发明涉及一种含磷聚苯醚树脂、其制备方法、含磷聚苯醚预聚物的制备方法、树脂组合物及其制品，其中含磷聚苯醚树脂具有下式（I）所代表的化学结构： 其中 R′是 R″ 是 R′″ 是氢、 通过使用上述含磷聚苯氧化物树脂，由该树脂组合物制成的物品可以具有良好的阻燃性、良好的耐热性和较低的热膨胀率，同时还能保持介电性能，因此本发明适用于覆铜箔层压板和印刷电路板等产品。
• Thermosetting resin composition and method of producing same
  申请人：Namics Corporation

  公开号：US10388583B2

  公开（公告）日：2019-08-20

  Provided is a thermosetting resin composition, which can be used as underfill for obtaining favorable solder connectivity while suppressing the formation of voids in the case of treating under heating conditions required by the underfill in a semiconductor chip thermocompression bonding step using the thermal compression bonding technique. The thermosetting resin composition contains a thermosetting resin, a curing agent and a fluxing agent, and the temperature at which the rate of temperature change of viscosity when temperature is increased according to a prescribed heating profile reaches 30 Pa·s/° C. is 200° C. to 250° C.

  本发明提供了一种热固性树脂组合物，在使用热压焊接技术的半导体芯片热压焊接步骤中，该组合物可用作底层填充物，用于在底层填充物所需的加热条件下进行处理的情况下，获得良好的焊料连通性，同时抑制空隙的形成。热固性树脂组合物包含热固性树脂、固化剂和助焊剂，根据规定的加热曲线升温时粘度的温度变化率达到 30 Pa-s/°C 的温度为 200°C 至 250°C。
• KUTYREV, A. A.;LEBEDEVA, O. E.;MOSKVA, V. V., ZH. OBSHCH. XIMII, 60,(1990) N, S. 1665-1666
  作者：KUTYREV, A. A.、LEBEDEVA, O. E.、MOSKVA, V. V.

  DOI：——

  日期：——
• NOVEL EPOXY PHOSPHOROUS-CONTAINING RESIN, EPOXY RESIN COMPOSITION ESSENTIALLY CONTAINING THE EPOXY RESIN, AND CURED PRODUCT OF THE EPOXY RESIN COMPOSITION
  申请人：Yokoyama Naoki

  公开号：US20100093928A1

  公开（公告）日：2010-04-15

  Disclosed is a novel phosphorous containing epoxy resin having a naphthalene skeletal represented by represented by following general formula (1), a is 1, 2, 3, 4, 5 or 6; b is 1, 2, 3, 4, 5, 6 or 7; c is 0, 1, 2, 3 or more; X represents benzene, naphthalene, anthracene, phenanthrene or biphenyl; and Y represents, for example, a group represented by following general formula (3). In formula (3), d is 0 or 1; and R 1 and R 2 represent a straight chain, branched or cyclic hydrocarbon group, or alternatively, R 1 and R 2 may combine together to form a ring structure. This epoxy resin is suitable for an insulating material such as a copper-clad laminate used in an electronic circuit board and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material as material for an electrically insulating coating.