The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.
LIQUID CRYSTAL MATERIAL COMPOSITION AND DISPLAY DEVICE
申请人:Japan Display Inc.
公开号:US20210301206A1
公开(公告)日:2021-09-30
According to one embodiment, a liquid crystal material composition includes a liquid crystal mixture containing at least one kind of each of a first liquid crystalline compound, a second liquid crystalline compound and a third liquid crystalline compound, a polymerization initiator and a monomer compound including acryloyl groups at respective terminals.
[EN] DIELECTRIC MATERIALS BASED ON BISMALEIMIDES CONTAINING CARDO/SPIRO MOIETIES<br/>[FR] MATÉRIAUX DIÉLECTRIQUES À BASE DE BISMALÉIMIDES CONTENANT DES FRAGMENTS CARDO/SPIRO
申请人:[en]MERCK PATENT GMBH
公开号:WO2022117715A1
公开(公告)日:2022-06-09
The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with a cardo and/or spiro moiety containing repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material and an electronic device comprising the same as dielectric material.