2,7-Dichlor-naphthalin-tetracarbonsaeure-(1,4,5,8) | 92167-12-9

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 2,7-Dichlor-naphthalin-tetracarbonsaeure-(1,4,5,8)
• 英文别名: 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic acid
• CAS: 92167-12-9
• 化学式: C₁₄H₆Cl₂O₈
• 分子量: 373.103
• InChiKey: JZWGLBCZWLGCDT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  24
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  149
• 氢给体数：
  4
• 氢受体数：
  8

文献信息

• Polyimides
  申请人：FUJIFILM ELECTRONIC MATERIALS U.S.A. INC.

  公开号：US11061327B2

  公开（公告）日：2021-07-13

  A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

  一种聚酰亚胺聚合物，包括以下反应产物：(a)至少一种从结构式(Ia)和结构式(Ib)组成的二胺中选择的二胺，(b)至少一种结构式(II)的二胺，(c)至少一种四羧酸二酐，以及可选地(d)至少一种含有第一官能团与胺或酸酐反应的化合物，以及至少一种从取代或未取代的烯烃基和取代或未取代的炔基中选择的第二官能团。上述公式中的每个变量在说明书中有定义。
• Aromatic polyamic acid and polyimide
  申请人：Wang Hongyuan

  公开号：US20070149758A1

  公开（公告）日：2007-06-28

  The present invention relates to an aromatic polyimide which has excellent heat resistance and excellent thermal dimensional stability, and which realizes low hygroscopic property, and an aromatic polyamic acid as a precursor for the aromatic polyimide. Provided are an aromatic polyamic acid including a structural unit represented by the following general formula (1), and an aromatic polyimide obtained by imidating the aromatic polyamic acid. The aromatic polyamic acid or the aromatic polyimide can be a copolymerization-type aromatic polyamic acid or aromatic polyimide having another structural unit: where, Ar 1 represents a tetravalent organic group produced from a tetracarboxylic acid having one or more aromatic rings, and R represents a hydrocarbon having 2 to 6 carbon atoms.

  本发明涉及一种具有优异耐热性和优异热尺寸稳定性的芳香族聚酰亚胺，实现低吸湿性能，并提供作为该芳香族聚酰亚胺前体的芳香族聚酰胺。提供了一种包括下述一般式（1）所表示的结构单元的芳香族聚酰胺和通过对芳香族聚酰胺进行酰亚胺化而得到的芳香族聚酰亚胺。芳香族聚酰胺或芳香族聚酰亚胺可以是具有另一种结构单元的共聚型芳香族聚酰胺或芳香族聚酰亚胺：其中，Ar1表示由具有一个或多个芳环的四羧酸产生的四价有机基团，而R表示具有2至6个碳原子的碳氢化合物。
• FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME
  申请人：Masuko Takashi

  公开号：US20100239858A1

  公开（公告）日：2010-09-23

  An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive layer comprising at least one resin selected from the group consisting of polyurethaneimide resins, polyurethaneamideimide resins and polyurethaneimide-polyurethaneamideimide resins.

  本发明的目的是提供一种类似于薄膜的粘合剂，能够实现优秀的加工性和回流抗性的组合。本发明的类似于薄膜的粘合剂用于将半导体元件粘合到粘合体上，包括一个粘合层，该粘合层包括至少一种树脂，所述树脂从聚氨酯酰亚胺树脂、聚氨酯酰胺酰亚胺树脂和聚氨酯酰亚胺-聚氨酯酰胺酰亚胺树脂组成的群体中选出。
• CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER
  申请人：Arifuku Motohiro

  公开号：US20100243303A1

  公开（公告）日：2010-09-30

  The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.

  本发明提供了一种电路连接材料，用于电性连接第一电路基板的主表面上形成有第一电路电极的第一电路部件和第二电路基板的主表面上形成有第二电路电极的第二电路部件，其中第一和第二电路电极相对，包括含有含氟有机化合物的粘合剂组分，其中粘合剂组分在总量的基础上，含有的含硅化合物质量分数不超过0.10%。
• THERMOSETTING RESIN COMPOSITION
  申请人：Ichinose Eiju

  公开号：US20090192273A1

  公开（公告）日：2009-07-30

  The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provide a thermosetting resin composition containing a polyurethane resin (A) which has the structure represented by the following general formula (1) and/or the general formula (2), and an epoxy resin (B). (In the chemical formulae, X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.)

  本发明的目的是提供一种热固性树脂组合物，可以提供具有耐热性、电性能和柔韧性的固化材料，并且在固化之前具有储存稳定性。为了实现这个目的，本发明提供了一种热固性树脂组合物，包含具有以下通式（1）和/或通式（2）所表示结构的聚氨酯树脂（A），以及环氧树脂（B）。（在化学式中，X代表分子中排除了两个酚羟基的酚化合物的残基，该酚化合物具有两个或更多的酚羟基。）