PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
申请人:ASAHI KASEI E-MATERIALS CORPORATION
公开号:US20140349222A1
公开(公告)日:2014-11-27
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R
1
to R
7
, m
1
to m
4
, n
1
, n
2
, Y and W are each as defined in the description.
US9575410B2
申请人:——
公开号:US9575410B2
公开(公告)日:2017-02-21
[EN] PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT<br/>[FR] COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM SEC, PRODUIT DURCI, ET COMPOSANT ÉLECTRONIQUE<br/>[JA] 感光性樹脂組成物、ドライフィルム、硬化物、および電子部品