申请人:HERCULES INCORPORATED
公开号:EP0424866A2
公开(公告)日:1991-05-02
Disclosed is a UV-curable, aqueous-developable liquid solder mask composition comprising (1) 40% to 70% of a non-reactive binder that is a film-forming random copolymer of (a) one or more (meth)acrylic alkyl ester monomers, at least one of which is an ester of a 4-12 carbon alkanol, (b) acrylic or methacrylic acid, and optionally (c) styrene or α-methylstyrene, (2) 20% to 40% of one or more (meth)acrylic ester monomers containing two or more ethylenic double bonds, wherein at least one of the monomers has at least four ethylenic double bonds, (3) 1% to 5% of a photoinitiator, (4) 5% to 15% of a filler, all percentages being by weight based on the nonsolvent components of the composition, and (5) 35% to 70% of an organic solvent, based on the total weigt of the composition.
本发明公开了一种紫外线固化、可在水溶液中显影的液态焊料掩模组合物,该组合物包含 (1) 40% 至 70% 的非反应性粘合剂,该粘合剂是以下物质的成膜无规共聚物:(a) 一种或多种(甲基)丙烯酸烷基酯单体,其中至少一种是 4-12 碳烷醇的酯,(b) 丙烯酸或甲基丙烯酸,以及可选的 (c) 苯乙烯或 α-甲基苯乙烯、(2) 20%至 40%的一种或多种含有两个或两个以上乙烯双键的(甲基)丙烯酸酯单体,其中至少一种单体具有至少四个乙烯双键, (3) 1%至 5%的光引发剂, (4) 5%至 15%的填料,所有百分比均以组合物非溶剂组分的重量为基准, (5) 35%至 70%的有机溶剂,以组合物总重量为基准。