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2-Ethyl-4-methyl-oxetan | 5410-21-9

中文名称
——
中文别名
——
英文名称
2-Ethyl-4-methyl-oxetan
英文别名
2-Ethyl-4-methyloxetane
2-Ethyl-4-methyl-oxetan化学式
CAS
5410-21-9
化学式
C6H12O
mdl
——
分子量
100.161
InChiKey
VYFPDWQFHMAQNZ-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.6
  • 重原子数:
    7
  • 可旋转键数:
    1
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    9.2
  • 氢给体数:
    0
  • 氢受体数:
    1

SDS

SDS:c81eff4c795965be2e7491f65ee591fa
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反应信息

  • 作为产物:
    描述:
    5-chloro-hexan-3-ol氢氧化钾 作用下, 生成 2-Ethyl-4-methyl-oxetan 、 alkaline earth salt of/the/ methylsulfuric acid
    参考文献:
    名称:
    Trimethylene Oxides. I. Reaction of 2-Chloro-4-hexanol and 1-Phenyl-3-chloro-1-butanol with Alkali1
    摘要:
    DOI:
    10.1021/ja01630a016
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文献信息

  • Experimental Investigation of the Low Temperature Oxidation of the Five Isomers of Hexane
    作者:Zhandong Wang、Olivier Herbinet、Zhanjun Cheng、Benoit Husson、René Fournet、Fei Qi、Frédérique Battin-Leclerc
    DOI:10.1021/jp503772h
    日期:2014.7.31
    The low-temperature oxidation of the five hexane isomers (n-hexane, 2-methyl-pentane, 3-methyl-pentane, 2,2-dimethylbutane, and 2,3-dimethylbutane) was studied in a jet-stirred reactor (JSR) at atmospheric pressure under stoichiometric conditions between 550 and 1000 K. The evolution of reactant and product mole fraction profiles were recorded as a function of the temperature using two analytical methods: gas chromatography and synchrotron vacuum ultraviolet photoionization mass spectrometry (SVUV-PIMS). Experimental data obtained with both methods were in good agreement for the five fuels. These data were used to compare the reactivity and the nature of the reaction products and their distribution. At low temperature (below 800 K), n-hexane was the most reactive isomer. The two methyl-pentane isomers have about the same reactivity, which was lower than that of n-hexane. 2,2-Dimethylbutane was less reactive than the two methyl-pentane isomers, and 2,3-dimethylbutane was the least reactive isomer. These observations are in good agreement with research octane numbers given in the literature. Cyclic ethers with rings including 3, 4, 5, and 6 atoms have been identified and quantified for the five fuels. While the cyclic ether distribution was notably more detailed than in other literature of JSR studies of branched alkane oxidation, some oxiranes were missing among the cyclic ethers expected from methyl-pentanes. Using SVUV-PIMS, the formation of C-2-C-3 monocarboxylic acids, ketohydroperoxides, and species with two carbonyl groups have also been observed, supporting their possible formation from branched reactants. This is in line with what was previously experimentally demonstrated from linear fuels. Possible structures and ways of decomposition of the most probable ketohydroperoxides were discussed. Above 800 K, all five isomers have about the same reactivity, with a larger formation from branched alkanes of some unsaturated species, such as allene and propyne, which are known to be soot precursors.
  • Chemicals from Hydrocarbons by Vapor Phase Oxidation
    作者:Jennings Jones、Merrell Fenske
    DOI:10.1021/ie51394a030
    日期:1959.3
  • AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS
    申请人:BASF SE
    公开号:EP2614122A1
    公开(公告)日:2013-07-17
  • US9845669B2
    申请人:——
    公开号:US9845669B2
    公开(公告)日:2017-12-19
  • [EN] AQUEOUS POLISHING COMPOSITIONS CONTAINING N-SUBSTITUTED DIAZENIUM DIOXIDES AND/OR N'-HYDROXY-DIAZENIUM OXIDE SALTS<br/>[FR] COMPOSITIONS DE POLISSAGE AQUEUSES CONTENANT DES DIOXYDES DE DIAZÉNIUM N-SUBSTITUÉS ET/OU DES SELS D'OXYDE DE N'-HYDROXY-DIAZÉNIUM
    申请人:BASF SE
    公开号:WO2012032466A1
    公开(公告)日:2012-03-15
    An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and N'-hydroxy-diazenium oxide salts; and (B) at least one type of abrasive particles; the use of the compounds (A) for manufacturing electrical, mechanical and optical devices and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.
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