3-hydroxy-5,7-disulfo-[2]naphthoic acid | 56507-31-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 3-hydroxy-5,7-disulfo-[2]naphthoic acid
• 英文别名: 3-Hydroxy-5,7-disulfo-[2]naphthoesaeure；3-Hydroxy-5,7-disulpho-2-naphthoesaeure；3-Hydroxy-5,7-disulfo-2-naphthoesaeure；3-Hydroxy-5.7-disulfo-2-naphthoesaeure；3-Hydroxy-5,7-disulfonaphthalene-2-carboxylic acid
• CAS: 56507-31-4
• 化学式: C₁₁H₈O₉S₂
• 分子量: 348.311
• InChiKey: SKMUYYVJCDNFGM-UHFFFAOYSA-N

物化性质

• 密度：
  1.934±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  0.4
• 重原子数：
  22
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  183
• 氢给体数：
  4
• 氢受体数：
  9

反应信息

• 作为产物：
  描述：

  2-羟基-3-萘甲酸 在 硫酸 、 三氧化硫 作用下， 生成 3-hydroxy-5,7-disulfo-[2]naphthoic acid
  参考文献：
  名称：

  Schmid, Chemische Berichte, 1893, vol. 26, p. 1121

  摘要：

  DOI：

文献信息

• Ink for inkjet printing, lithographic printing plate using it and method for making such plate
  申请人：FUJI PHOTO FILM CO., LTD.

  公开号：EP1693427A2

  公开（公告）日：2006-08-23

  The present invention provides an ink for use in inkjet printing which can be cured by irradiation of radiant ray, characterized in that said ink for use in inkjet printing contains at least a colorant, a polymerizable compound and a photopolymerization initiator, further comprising a compound capable of forming a complex with a metal, as well as a method for making a lithographic printing plate that doesn't need a development process using said ink, and such plate can solve the foregoing problem. The ink of the present invention for use in inkjet printing has an excellent adhesion between the ink cured by irradiation of radiant ray and a printing medium, as well as a lithographic printing plate using it and a method for making such plate.

  本发明提供了一种可通过辐射线照射固化的喷墨印刷用墨水，其特征在于所述喷墨印刷用墨水至少含有着色剂、可聚合化合物和光聚合引发剂，还包括一种能够与金属形成络合物的化合物，以及一种使用所述墨水制作无需显影工序的平版印刷版的方法，这种版可以解决上述问题。本发明用于喷墨印刷的墨水在通过辐射线照射固化的墨水和印刷介质之间具有极佳的附着力，还包括使用本发明墨水的平版印刷板和制作这种印版的方法。
• PROCESSES, COMPOSITIONS AND COMPOUNDS
  申请人：FUJIFILM Imaging Colorants Limited

  公开号：EP1527141B1

  公开（公告）日：2010-01-27
• NON-FLUORIDE CONTAINING COMPOSITION FOR THE REMOVAL OF RESIDUE FROM A MICROELECTRONIC DEVICE
  申请人：Korzenski Michael

  公开号：US20100261632A1

  公开（公告）日：2010-10-14

  Cleaning compositions and processes for removing residue from a microelectronic device having said residue thereon. The composition, which is substantially devoid of fluoride species, amine species, and organic solvents, achieves highly efficacious cleaning of the residue material, including post-etch residue, post-ash residue and/or post-CMP residue, from the microelectronic device while simultaneously not damaging the interlevel dielectric and metal interconnect material also present thereon.
• AQUEOUS CLEANER FOR THE REMOVAL OF POST-ETCH RESIDUES
  申请人：ADVANCED TECHNOLOGY MATERIALS, INC.

  公开号：US20150307818A1

  公开（公告）日：2015-10-29

  Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.
• US7690783B2
  申请人：——

  公开号：US7690783B2

  公开（公告）日：2010-04-06