1-Nitrosonaphthalene-2-carbaldehyde | 91659-96-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 1-Nitrosonaphthalene-2-carbaldehyde
• CAS: 91659-96-0
• 化学式: C₁₁H₇NO₂
• 分子量: 185.18
• InChiKey: ZKYBMKRZYMBWHZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  14
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  46.5
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3633455A1

  公开（公告）日：2020-04-08

  Provided are a photosensitive resin composition which has high breaking elongation and high excellent storage stability in case of forming a cured film, a polymer precursor, a cured film, a laminate, a method for producing a cured film, and a semiconductor device to solve the problems. A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

  本发明提供了一种在形成固化膜的情况下具有高断裂伸长率和高优异储存稳定性的光敏树脂组合物、一种聚合物前体、一种固化膜、一种层压板、一种固化膜的生产方法以及一种解决上述问题的半导体设备。本发明还提供了一种光敏树脂组合物，它包括选自聚酰亚胺前体和聚苯并恶唑前体的聚合物前体；光辐射聚合引发剂；以及溶剂，其中聚合物前体所含酸性基团的酸值在 pH 值为 7.0至12.0范围内的酸值为2.5至34.0 mgKOH/g，聚合物前体含有可辐射聚合的基团，或者感光树脂组合物包括聚合物前体以外的可辐射聚合的化合物。
• PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：EP3859447A1

  公开（公告）日：2021-08-04

  A photosensitive resin composition exhibiting an excellent cyclization rate and excellent storage stability is provided. In addition, a cured film obtained by using the photosensitive resin composition, a laminate, a method for manufacturing cured film, and a semiconductor device are provided. The photosensitive resin composition contains a specific thermal base generator and a precursor of a heterocyclic ring-containing polymer. The specific thermal base generator has a structure in which a hydroxyl group and an amide structure (-C(=O)-N=) are linked by a hydrocarbon group L, where L has a saturated hydrocarbon group on a path of the linking chain in L, and the number of atoms on the path of the linking chain is 3 or more.

  本发明提供了一种光敏树脂组合物，它具有优异的环化率和出色的储存稳定性。此外，还提供了使用该感光树脂组合物获得的固化膜、层压板、固化膜的制造方法和半导体器件。光敏树脂组合物包含特定热基发生器和含杂环聚合物的前体。特定热基发生器具有羟基和酰胺结构（-C(=O)-N=）通过烃基 L 连接的结构，其中 L 的连接链路径上具有饱和烃基，且连接链路径上的原子数为 3 个或更多。
• CURABLE RESIN COMPOSITION, CURED FILM, LAYERED BODY, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR
  申请人：FUJIFILM Corporation

  公开号：EP3940018A1

  公开（公告）日：2022-01-19

  There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.

  提供了一种含有至少一种聚合物前体的可固化树脂组合物，该聚合物前体选自由聚酰亚胺前体和聚苯并恶唑前体组成的组，其中聚合物前体具有包含两个或多个氮原子的杂环结构，且聚合物前体的酸值为 1 mmol/g 或更低；还提供了一种通过固化该可固化树脂组合物而获得的固化薄膜、一种包含该固化薄膜的层压板、一种制造该固化薄膜的方法、一种包含该固化薄膜或层压板的半导体器件以及一种新型聚合物前体。
• PHOTOSENSITIVE RESIN COMPOSITION, POLYMER PRECURSOR, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20200089113A1

  公开（公告）日：2020-03-19

  A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.
• CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR
  申请人：FUJIFILM Corporation

  公开号：US20220002488A1

  公开（公告）日：2022-01-06

  There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.