申请人:KOLON INDUSTRIES, INC.
公开号:US20190169177A1
公开(公告)日:2019-06-06
The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.
本发明涉及一种基于苯并噁嗪的混合物及其用途,更具体地,涉及一种基于苯并噁嗪的混合物及其固化产物的用途,其中该苯并噁嗪基混合物在分子结构中包含苯并噁嗪环,因此具有高介电特性、耐热特性和阻燃特性,可用于铜覆盖层层压板或电子部件中使用的密封材料、成型材料、模板材料、粘合剂、电绝缘漆材料等,用于印刷电路板。