6-hydroxy-N-[4-[2-[3-[2-[4-methoxy-2-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenyl]-2-oxoethoxy]phenyl]naphthalene-2-carboxamide

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 6-hydroxy-N-[4-[2-[3-[2-[4-methoxy-2-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenyl]-2-oxoethoxy]phenyl]naphthalene-2-carboxamide
• 化学式: C₄₆H₃₄NO₉P
• 分子量: 775.7
• InChiKey: DGIBVDMGRCHXBY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  8.5
• 重原子数：
  57
• 可旋转键数：
  12
• 环数：
  8.0
• sp3杂化的碳原子比例：
  0.07
• 拓扑面积：
  138
• 氢给体数：
  2
• 氢受体数：
  9

文献信息

• EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140076198A1

  公开（公告）日：2014-03-20

  Disclosed herein are an epoxy resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the epoxy resin composition including: a chitin nanoparticle or a chitin nanofiber; a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer; an epoxy resin; and an inorganic filler, so that the epoxy resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.