申请人:ASAHI DENKA KOGYO KABUSHIKI KAISHA
公开号:EP0197458A2
公开(公告)日:1986-10-15
A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic , resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.
本发明提供了一种单组分热固性环氧树脂组合物,其不可或缺的成分包括:(I) 分子中平均含有一个以上相邻环氧基团的环氧树脂;(II) 固化量或固化加速量的化合物,该化合物由(a)特定的胺/环氧加合物与(b)酚醛树脂和/或多羟基酚化合物反应而得,(a)与(b)的重量比为 1/0.1 至 1/0.8。本发明的组合物具有极佳的储存稳定性,可在相对较低的温度下固化,形成具有极佳机械强度、粘合性和耐水性的固化产品。