1,2,3,4,4a,5,6,7,8,8a-Decahydronaphthalene-1-carbohydrazide

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 1,2,3,4,4a,5,6,7,8,8a-Decahydronaphthalene-1-carbohydrazide
• 英文别名: 1,2,3,4,4a,5,6,7,8,8a-decahydronaphthalene-1-carbohydrazide
• 化学式: C₁₁H₂₀N₂O
• 分子量: 196.29
• InChiKey: NGTKRMZMRZZCKY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  14
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.91
• 拓扑面积：
  55.1
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• Thermoset resin composite materials comprising inter-laminar toughening particles
  申请人：CYTEC INDUSTRIES INC.

  公开号：US10815373B2

  公开（公告）日：2020-10-27

  A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.

  一种树脂系统，含有 (i) 热固性树脂前体组分，包括一种或多种多功能环氧树脂前体，其官能度至少为 3，其中所述前体最好选自三官能环氧树脂前体和/或四官能环氧树脂前体； (ii) 热塑性聚酰胺颗粒成分，其中聚酰胺颗粒的熔化温度为 TPA；以及 (iii) 一种或多种固化剂、 其中树脂前体组分、热塑性粒子和固化剂的选择应使树脂系统固化周期中环氧基体的凝胶化发生在凝胶化温度 TGEL（TPA 或低于 TPA）时。
• THERMOSET RESIN COMPOSITE MATERIALS COMPRISING INTER-LAMINAR TOUGHENING PARTICLES
  申请人：Cytec Industries Inc.

  公开号：EP2888306A2

  公开（公告）日：2015-07-01
• Thermoset Resin Composite Materials Comprising Inter-Laminar Toughening Particles
  申请人：Cytec Industries Inc.

  公开号：US20140135443A1

  公开（公告）日：2014-05-15

  A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature T PA ; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature T GEL which is at or below T PA .
• [EN] THERMOSET RESIN COMPOSITE MATERIALS COMPRISING INTER-LAMINAR TOUGHENING PARTICLES<br/>[FR] MATÉRIAUX COMPOSITES À BASE DE RÉSINE THERMODURCIE COMPRENANT DES PARTICULES DE DURCISSEMENT INTERLAMINAIRE
  申请人：CYTEC IND INC

  公开号：WO2014078095A2

  公开（公告）日：2014-05-22

  A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.
• [EN] PRIMER COMPOSITION FOR ADHESIVE BONDING AND METHOD OF USING THE SAME<br/>[FR] COMPOSITION DE PRIMAIRE POUR LIAISON ADHÉSIVE ET SON PROCÉDÉ D'UTILISATION
  申请人：CYTEC IND INC

  公开号：WO2021087238A1

  公开（公告）日：2021-05-06

  Disclosed herein is a solvent-based bonding primer composition containing one or more organic solvents, one or more epoxy resins, one or more curing agents, a silane compound, and a low amount of core-shell rubber particles in nanometer size, submicron or micron size. Also disclosed is a method of applying the solvent-based bonding primer composition onto a metallic surface of a first substrate prior to bonding the metallic surface to a second substrate via a curable adhesive.