A curable resin composition which is in a liquid form at ordinary temperature and provides a cured product having excellent heat resistance and a low thermal expansion rate is provided. The curable resin composition according to the present invention comprises: a cyanate ester compound (A) represented by the following formula (I); and a curing accelerator (B):
wherein R1represents a hydrocarbon group having 2 to 20 carbon atoms.
本发明提供了一种可固化
树脂组合物,该组合物在常温下呈液态,固化后的产品具有极佳的耐热性和较低的热膨胀率。根据本发明的可固化
树脂组合物包括:由下式(I)表示的
氰酸酯化合物(A);和固化
促进剂(B):
其中 R1 代表具有 2 至 20 个碳原子的烃基。