INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME
申请人:SAMSUNG ELECTRO-MECHANICS CO., LTD.
公开号:US20150065608A1
公开(公告)日:2015-03-05
Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.