[6-[2-[4-[2-[4-[2-[3-[2-[4-[(6-Hydroxynaphthalene-2-carbonyl)amino]phenoxy]acetyl]phenyl]-2-oxoethoxy]-3-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenoxy]acetyl]naphthalen-2-yl] 6-hydroxynaphthalene-2-carboxylate

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: [6-[2-[4-[2-[4-[2-[3-[2-[4-[(6-Hydroxynaphthalene-2-carbonyl)amino]phenoxy]acetyl]phenyl]-2-oxoethoxy]-3-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenoxy]acetyl]naphthalen-2-yl] 6-hydroxynaphthalene-2-carboxylate
• 英文别名: [6-[2-[4-[2-[4-[2-[3-[2-[4-[(6-hydroxynaphthalene-2-carbonyl)amino]phenoxy]acetyl]phenyl]-2-oxoethoxy]-3-(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)phenoxy]acetyl]phenoxy]acetyl]naphthalen-2-yl] 6-hydroxynaphthalene-2-carboxylate
• 化学式: C₇₆H₅₂NO₁₅P
• 分子量: 1250.2
• InChiKey: FIAIEZGYVBXDRZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  14.9
• 重原子数：
  93
• 可旋转键数：
  22
• 环数：
  13.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  227
• 氢给体数：
  3
• 氢受体数：
  15

文献信息

• RESIN COMPOSITION WITH ENHANCED HEAT-RELEASING PROPERTIES, HEAT-RELEASING FILM, INSULATING FILM, AND PREPREG
  申请人：SAMSUNG ELECTRO-MECHANICS CO., LTD.

  公开号：US20140187674A1

  公开（公告）日：2014-07-03

  This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.