The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R1 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, R2 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.) (In formula (2), R3 represents an organic group having 1 or more carbon atoms, and R4 to R6 represent hydrogen atoms, methyl groups or ethyl groups.)
本发明是一种环氧
树脂组合物,其特征在于含有组分A(分子中含有
硫原子的环氧
树脂);组分B(含有由式(1)表示的
咪唑化合物的环氧
树脂组合物,以及下列组分中的至少一种:组分C(由下式(2)表示的
咪唑化合物)或组分D(分子中至少含有一个
硫原子的环氧
树脂组合物。根据本发明,可以提供一种环氧
树脂组合物,该组合物在室温下储存时具有出色的稳 定性,并且可以在相对较低的温度和较短的时间内进行热固化,固化后的
树脂具有较高的 耐热性。式(1)中,R1 代表具有 1 至 5 个碳原子的直链或支链烷基,或羟甲基,R2 代表具有 1 至 5 个碳原子的直链或支链烷基,或氢原子)。(在式 (2) 中,R3 代表具有 1 个或多个碳原子的有机基团,R4 至 R6 代表氢原子、甲基或乙基)。