A resin composition and a use thereof is provided. The resin composition includes, in parts by weight, 100 parts of an alkali-soluble resin, 5-30 parts of acrylate monomers, 0.1-10 parts of photoinitiator, 10-30 parts of a first epoxy resin and 0-15 parts of a second epoxy resin. The first epoxy resin is a low-dielectric epoxy resin with a dielectric constant of <3.5, and the second epoxy resin is different from the first epoxy resin. With the addition of the low epoxy resin with the dielectric constant of < 3.5, and by adjusting the ratio of the components, the resin composition significantly reduces the dielectric constant and dielectric loss, the dielectric constant is reduced to 3.0 or less, and the dielectric loss is reduced to 0.008 or less. In addition, the resin composition also provides excellent heat resistance, resolution, and a reduced resilience, and also provides relatively improved flexibility and bending resistance. At the same time, the resin composition is a photosensitive resin composition and allows an image transfer by means of photographic development.
提供了一种
树脂组合物及其用途。以重量份数计,该
树脂组合物包括 100 份碱溶性
树脂、5-30 份
丙烯酸酯单体、0.1-10 份光
引发剂、10-30 份第一环氧
树脂和 0-15 份第二环氧
树脂。第一环氧
树脂是介电常数小于 3.5 的低介电环氧
树脂,第二环氧
树脂与第一环氧
树脂不同。通过添加介电常数小于 3.5 的低介电常数环氧
树脂,并调整各组分的比例,该
树脂组合物可显著降低介电常数和介电损耗,介电常数降至 3.0 或更低,介电损耗降至 0.008 或更低。此外,该
树脂组合物还具有优异的耐热性、解析度和较低的回弹性,并相对提高了柔韧性和抗弯曲性。同时,该
树脂组合物是一种感光
树脂组合物,可通过照相显影进行图像转移。