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2-Imino-4-methylsulfonylnaphthalen-1-one

中文名称
——
中文别名
——
英文名称
2-Imino-4-methylsulfonylnaphthalen-1-one
英文别名
2-imino-4-methylsulfonylnaphthalen-1-one
2-Imino-4-methylsulfonylnaphthalen-1-one化学式
CAS
——
化学式
C11H9NO3S
mdl
——
分子量
235.26
InChiKey
OXGGBIDIGKLMPS-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    0.5
  • 重原子数:
    16
  • 可旋转键数:
    1
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.09
  • 拓扑面积:
    83.4
  • 氢给体数:
    1
  • 氢受体数:
    4

文献信息

  • NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
    申请人:SHIN-ETSU CHEMICAL CO., LTD.
    公开号:US20190169211A1
    公开(公告)日:2019-06-06
    The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).
    本发明是基于本文中的情况而作出的。本发明的目的是提供:一种四羧酸二酐,可导致聚酰亚胺,作为感光树脂组合物的基树脂,能够形成细微图案并获得高分辨率,同时不损害优异的特性,如机械强度和粘附性;通过使用该四羧酸二酐获得的聚酰亚胺树脂;以及生产该聚酰亚胺树脂的方法。该四羧酸二酐由以下通用式(1)所示。
  • RESIN COMPOSITION
    申请人:TORAY INDUSTRIES, INC.
    公开号:US20190241716A1
    公开(公告)日:2019-08-08
    The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO) n —; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO) n —; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.
    本发明提供了一种树脂组合物,具有高灵敏度,并用于生产具有低吸率的固化膜。该树脂组合物包括:(a)可溶于碱的树脂和(b1)含有羟基的酰胺化合物,其中羟基化合物中的单价基在邻位上,和/或(b2)含有羧基的芳香酰胺酸化合物,其中羧基化合物中的单价基在邻位上,其通式如下所示:在通式(1)中,X是一个单价有机基,具有含有2到20个碳原子的烷基,并直接连接到通式(1)中的羰基碳,或具有—(YO)n—的单价有机基;在通式(2)中,U是一个单价有机基,具有含有2到20个碳原子的烷基,并直接连接到通式(2)中的酰胺氮,或具有—(YO)n—的单价有机基;其中Y是含有1到10个碳原子的烷基,n是1到20的整数。
  • Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate
    申请人:SHIN-ETSU CHEMICAL CO., LTD.
    公开号:US10197914B2
    公开(公告)日:2019-02-05
    The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.
    本发明提供了一种含有(A)含有硅氧烷链的聚合物化合物的阳性感光树脂组合物,该聚合物化合物具有由通式(1)所示的重复单元和重量平均分子量为3,000至500,000,(B)能够通过光生成酸并增加在性碱性溶液中的溶解速率的感光材料,(C)交联剂和(D)溶剂。可以提供一种阳性感光树脂组合物,可以解决在属线路(如Cu和Al)、电极和基板上引起的剥离问题,特别是在SiN等基板上,可以在使用广泛的2.38%TMAH溶液作为显影剂时,在图案底部和基板上形成具有前向锥形形状的细微图案,而不会产生污点和底部轮廓。
  • DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME
    申请人:TORAY INDUSTRIES, INC.
    公开号:US20170334837A1
    公开(公告)日:2017-11-23
    Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).
    提供了一种具有优异图案加工性(高灵敏度和高分辨率)且在热处理后具有优异化学耐性和热耐性的光敏树脂组合物;用于该组合物的耐热树脂或耐热树脂前体;以及作为树脂和前体原料的二胺化合物。该二胺化合物是由通式(1)表示的二胺化合物。
  • TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
    申请人:Shin-Etsu Chemical Co., Ltd.
    公开号:EP3235803A1
    公开(公告)日:2017-10-25
    The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), wherein X1 represents a tetravalent organic group; and R1 represents a group shown by the following general formula (2), wherein the dotted line represents a bond; Y1 represents an organic group with a valency of k+1; "k" represents 1 or 2; and "n" represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition and usable as a base resin of a photosensitive resin composition.
    本发明提供了一种四羧酸二酯化合物,其通式如下(1)、 其中 X1 代表四价有机基团;R1 代表下式通式(2)所示的基团、 其中虚线代表键;Y1 代表价数为 k+1 的有机基团;"k "代表 1 或 2;"n "代表 0 或 1。本发明提供了一种四羧酸二酯化合物,它可以得到一种可溶于广泛用作组合物溶剂的安全有机溶剂中的聚酰亚胺前体聚合物,并可用作感光树脂组合物的基树脂
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