Dimethyl-(2-naphthalen-2-yl-2-oxoethyl)sulfanium

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: Dimethyl-(2-naphthalen-2-yl-2-oxoethyl)sulfanium
• 化学式: C14H15OS+
• 分子量: 231.33
• InChiKey: QPCWAKFDFPYSSW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.6
• 重原子数：
  16
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.21
• 拓扑面积：
  18.1
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• Polycycloolefin polymeric compositions for semiconductor applications
  申请人：Ravikiran Ramakrisha

  公开号：US20060041093A1

  公开（公告）日：2006-02-23

  Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.

  用于半导体应用的聚合物组合物，包含 10 至 99 wt.%的降冰片烯类环烯烃单体（由式 I(a)、I(b)和可选的 I(c) 和/或 I(d)中的一种或多种代表）、0.0005 至 0.5 wt.%的加成聚合催化剂，以及可选的：最多 0.5 wt.%的交联单体、最多 50%的增粘剂、最多 20%的触变添加剂、最多 80%的填料、最多 10%的抗氧化剂和最多 0.6%的抗氧化增效剂。此类配方经大规模聚合或固化后形成的聚合物组合物具有各种特定的电子、微电子、光电子和微光电子应用所需的性能，如芯片连接粘合剂、底部填充材料、预浸料粘合剂、封装剂、保护层和其他相关应用。
• POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS
  申请人：Promerus, LLC

  公开号：EP1791888A1

  公开（公告）日：2007-06-06
• [EN] POLYCYCLOOLEFIN POLYMERIC COMPOSITIONS FOR SEMICONDUCTOR APPLICATIONS<br/>[FR] COMPOSITIONS POLYMÈRES DE POLYCYCLOOLÉFINE POUR APPLICATIONS POUR SEMI-CONDUCTEURS
  申请人：PROMERUS LLC

  公开号：WO2006023511A1

  公开（公告）日：2006-03-02

  Polymeric compositions for semiconductor applications comprising 10 to 99 wt.% of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt.% of an addition polymerization procatalyst, and optionally: up to 0.5 wt.% of a cocatalyst, up to 59 wt.% of a crosslinking monomer, up to 50 wt.% of a viscosifier, up to 20 wt.% of a thixotropic additive(s), up to 80 wt.% of a filler, up to 10 wt.% of an antioxidant, and up to 0.6 wt.% of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.