2-Oxo-1,2-diphenylethyl 2-methylbenzoate

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二苯乙烯类
• 英文名称: 2-Oxo-1,2-diphenylethyl 2-methylbenzoate
• 英文别名: (2-oxo-1,2-diphenylethyl) 2-methylbenzoate
• 化学式: C₂₂H₁₈O₃
• 分子量: 330.4
• InChiKey: CCUAUPRDUUYEBX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.2
• 重原子数：
  25
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.09
• 拓扑面积：
  43.4
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device
  申请人：LINTEC Corporation

  公开号：US10086594B2

  公开（公告）日：2018-10-02

  A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is −0.5 to 0.5% and the bending resistance of the base is 80 mm or more.

  一种附有粘合剂树脂层的板材包括基底和层压在基底上的粘合剂树脂层。板材在 70° C 下加热 1 分钟后，基底在 MD 方向和 CD 方向上的收缩率分别为-0.5%至 0.5%，基底的抗弯强度为 80 毫米或以上。
• Adhesive Compositions for a Semiconductor, an Adhesive Sheet for a Semiconductor and a Production Method of a Semiconductor Device
  申请人：Ichikawa Isao

  公开号：US20120196404A1

  公开（公告）日：2012-08-02

  An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.
• Resin Film Forming Sheet for Chip, and Method for Manufacturing Semiconductor Chip
  申请人：Shinoda Tomonori

  公开号：US20130011998A1

  公开（公告）日：2013-01-10

  A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.
• RESIN FILM FORMING SHEET FOR CHIP, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
  申请人：LINTEC Corporation

  公开号：US20140141570A1

  公开（公告）日：2014-05-22

  A sheet for forming a resin film for a chip, with which a semiconductor device is provided with a gettering function, is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a release sheet, and a resin film-forming layer, which is formed on the releasing face of the release sheet, and the resin film-forming layer contains a binder polymer component, a curing component, and a gettering agent.
• Dicing Sheet with Protective Film Forming Layer and Chip Fabrication Method
  申请人：LINTEC Corporation

  公开号：US20140295646A1

  公开（公告）日：2014-10-02

  A dicing sheet with a protective film forming layer has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130° C. or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130° C. for two hours is from −5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.