8-羟基萘-1-羧酸 | 1769-88-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 中文名称: 8-羟基萘-1-羧酸
• 英文名称: 8-hydroxy-[1]naphthoic acid
• 英文别名: 8-Hydroxy-[1]naphthoesaeure；8-Oxy-naphthalin-carbonsaeure-(1)；8-Hydroxy-<1>naphthoesaeure；8-Hydroxy-α-naphthoesaeure；8-Hydroxy-naphthoesaeure-(1)；1-Hydroxy-8-naphthoesaeure；8-Hydroxy-1-naphthoic acid；8-hydroxynaphthalene-1-carboxylic acid
• CAS: 1769-88-6
• 化学式: C₁₁H₈O₃
• 分子量: 188.183
• InChiKey: SHOOSJLGRQTMFC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.1
• 重原子数：
  14
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  57.5
• 氢给体数：
  2
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  8-羟基萘-1-羧酸 在 五氯化磷 作用下， 生成 8-phosphonooxy-[1]naphthoic acid
  参考文献：
  名称：

  The Mechanism of the Hydrolysis of Organic Phosphates. III. Aromatic Phosphates¹

  摘要：

  DOI：

  10.1021/ja01620a015
• 作为产物：
  描述：

  8-sulfo-1-naphthoic anhydride 生成 8-羟基萘-1-羧酸
  参考文献：
  名称：

  DE459404

  摘要：

  公开号：

文献信息

• NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20190169211A1

  公开（公告）日：2019-06-06

  The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).

  本发明是基于本文中的情况而作出的。本发明的目的是提供：一种四羧酸二酐，可导致聚酰亚胺，作为感光树脂组合物的基树脂，能够形成细微图案并获得高分辨率，同时不损害优异的特性，如机械强度和粘附性；通过使用该四羧酸二酐获得的聚酰亚胺树脂；以及生产该聚酰亚胺树脂的方法。该四羧酸二酐由以下通用式（1）所示。
• NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：International Business Machines Corporation

  公开号：US20210317270A1

  公开（公告）日：2021-10-14

  Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X 1 to X 3 represent any of —CO 2 —, —CONR X1 —, —O—, —NR X1 —, —S—, —SO 2 —, —SO 3 — and —SO 2 NR X1 — and may be the same as or different from each other, provided that R X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L 1 and L 2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.

  提供的是一种可以用作光敏树脂组合物的基树脂的化合物。这种光敏树脂可以形成精细图案，并且可以在不影响机械强度和溶解性的情况下实现高分辨率。该化合物由通式（1）表示：其中Z代表具有2到30个碳原子的线性、支链或环状二价碳氢基团；X1到X3代表任何一种—CO2—、—CONRX1—、—O—、—NRX1—、—S—、—SO2—、—SO3—和—SO2NRX1—中的一种，并且它们可以相同也可以不同，只要RX1是氢原子或具有1到30个碳原子的一价碳氢基团；Ar代表具有2到30个碳原子的二价芳香基团；L1和L2分别代表具有1到30个碳原子的二价碳氢基团；x和y分别独立地为0或1。
• TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20180120702A1

  公开（公告）日：2018-05-03

  The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1), wherein, X 1 represents a tetravalent organic group, and R 1 represents a group represented by the following general formula (2), wherein, the dotted line represents a bonding, Y 1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, “k” represents 1, 2 or 3, and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.

  本发明提供了一种四羧酸二酯化合物，其表示为以下通式（1）：其中，X1表示四价有机基团，R1表示以下通式（2）所表示的基团：其中，虚线表示键合，Y1表示具有k+1价的有机基团，Rs表示含有至少一个硅原子的基团，“k”表示1、2或3，“n”表示0或1。可以提供一种四羧酸二酯化合物，该化合物能够引导聚合物的形成，该聚合物是由使用负光敏树脂组合物的基树脂制成的，该组合物能够形成细微图案并具有高分辨率，使用四羧酸二酯化合物制得的聚酰亚胺前体聚合物以及其制备方法。
• DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170334837A1

  公开（公告）日：2017-11-23

  Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

  提供了一种具有优异图案加工性（高灵敏度和高分辨率）且在热处理后具有优异化学耐性和热耐性的光敏树脂组合物；用于该组合物的耐热树脂或耐热树脂前体；以及作为树脂和前体原料的二胺化合物。该二胺化合物是由通式（1）表示的二胺化合物。
• INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
  申请人：Ono Kazuo

  公开号：US20100179250A1

  公开（公告）日：2010-07-15

  It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).

  这是为了改善密封剂的储存稳定性，保持密封时密封剂的流动性，并通过加热实现密封剂的有效固化速率，以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物，包括以下组分（A）和组分（B）。（A）环氧树脂，（B）包括（b1）芳香羧酸化合物和（b2）至少一种由式（II）表示的咪唑化合物的笼形复合物（其中R2表示氢原子等；R3至R5表示氢原子等）。