1-Phenyl-1,1-bis-(p-tolyl)-2,2,2-trifluoroethane | 61204-08-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: 1-Phenyl-1,1-bis-(p-tolyl)-2,2,2-trifluoroethane
• 英文别名: 1,1'-(2,2,2-Trifluoro-1-phenylethane-1,1-diyl)bis(4-methylbenzene)；1-methyl-4-[2,2,2-trifluoro-1-(4-methylphenyl)-1-phenylethyl]benzene
• CAS: 61204-08-8
• 化学式: C₂₂H₁₉F₃
• 分子量: 340.388
• InChiKey: RUHHXEWMSWDXML-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.1
• 重原子数：
  25
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  2,2,2-三氟苯乙酮 、 甲苯 在 三氟甲磺酸 作用下， 生成 1-Phenyl-1,1-bis-(p-tolyl)-2,2,2-trifluoroethane
  参考文献：
  名称：

  Synthesis of multifunctional triarylfluoroethanes. 1. Condensation of fluoro ketones

  摘要：

  DOI：

  10.1021/jo00427a018

文献信息

• CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME
  申请人：Shengyi Technology Co., Ltd.

  公开号：EP3889233A1

  公开（公告）日：2021-10-06

  The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.

  本申请提供了一种电路材料和含有这种材料的电路板。电路材料包括导电金属层和电介质基板层，以及布置在其间的粘合剂层，其中粘合剂层由一种材料制成，该材料包括由树脂成分和非树脂成分组成的粘合剂组合物，其中树脂成分由不饱和聚苯醚树脂、SBS 树脂和马来酰亚胺树脂组成；粘合剂层是通过将溶解在溶剂中的粘合剂组合物以溶液的形式涂抹在导电金属层或电介质基底层的表面，或涂抹在脱模材料上，并在部分固化或完全固化后去除脱模材料而得到的。
• THERMOSETTING RESIN COMPOSITION
  申请人：Shengyi Technology Co., Ltd.

  公开号：US20200062889A1

  公开（公告）日：2020-02-27

  Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocarbyl phosphine oxide and one of bis-hydroxyl aromatic hydrocarbyl phosphine oxide, bis-hydroxyl aromatic oxyhydrocarbyl phosphine oxide, or hydroxylated DOPO, and then obtained from aromatic formyl chloride end capping; the thermosetting resin composition provided in the present invention has the advantages of good thermal stability, humidity resistance and heat resistance, a low dielectric constant and dielectric loss tangent, a low rate of water absorption, and halogen-free flame-retardant properties, and has excellent machinability; also provided in the present invention are applications of the thermosetting resin composition for resin sheet material, resin composite metal foil, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit boards.
• US4307024A
  申请人：——

  公开号：US4307024A

  公开（公告）日：1981-12-22
• US7365231B2
  申请人：——

  公开号：US7365231B2

  公开（公告）日：2008-04-29