A non-blocking, solid, adhesive composition which can be activated upon application of sufficient heat or ultrasonic energy without becoming C-staged, comprising (a) a first component having an epoxide-, hydroxy- or unsaturated functionality grater than 2, said polymeric resin being selected from the group consisting of polyesters, polyurethanes and epoxies; (b) a second component comprised of at least one filler, or at least one polyfunctional compound containing a polyaromatic backbone and having an average molecular weight below about 7000, or mixtures thereof, the weight ratio of said first component so said second component being between about 1.5 : 1 and about 9 : 1; and (c) a curing agent which is capable of reacting or initiating a reactio n with the functional groups of the polymeric resin to form crosslinks and cure the polymeric resin to a C-stage upon application of sufficient energy in the form of heat or radiant energy, said curing agent being non-reactive or blocked at the condition which will activate the adhesive composition, said curing agent being present in an amount sufficient to C-stage the polymeric resin. The adhesive composition is flexible, and in the C-stage, is capable of forming an infusible composition which does not melt, flow or decompose when exposed for 10 seconds to molten solder at 260°C and does not soften when exposed for 1 minute to dichloromethane at 25°C. The adhesive composition is suitable for bonding wire to a surface, to another wire or to itself.
一种非阻塞性固体粘合剂组合物,可在施加足够的热量或超声波能量时被激活,而不会变成 C 型,包括 (a) 第一组份,其环氧化、羟基或不饱和官能度大于 2,所述聚合物
树脂选自聚酯、聚
氨酯和环氧
树脂组成的组;(b) 由至少一种填料或至少一种含有多芳香族骨架且平均分子量低于约 7000 的多官能团化合物或其混合物组成的第二组分,所述第一组分与所述第二组分的重量比在约 1.5 : 1至约9 : 1之间;以及 (c) 一种固化剂,能够与聚合
树脂的官能团反应或引发反应,以形成交联,并在施加足够的热能或辐射能形式的能量时将聚合
树脂固化至C阶段,所述固化剂在将激活粘合剂组合物的条件下不发生反应或被阻断,所述固化剂的存在量足以使聚合
树脂C阶段。该粘合剂组合物具有柔韧性,在 C 阶段能够形成一种可注入的组合物,该组合物在 260°C 的温度下与熔融焊料接触 10 秒钟不会熔化、流动或分解,在 25°C 的温度下与
二氯甲烷接触 1 分钟不会软化。这种粘合剂组合物适用于将导线粘合到表面、另一根导线或导线本身。