Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US10017664B2
公开(公告)日:2018-07-10
Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1):
The obtained resin may have a unit structure of Formula (2):
Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.
NOVOLAC RESIN-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION USING BISPHENOL ALDEHYDE
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US20160068709A1
公开(公告)日:2016-03-10
Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1):
The obtained resin may have a unit structure of Formula (2):
Ar
1
and Ar
2
each are C
6-40
aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent.
Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.
Firstly, triarylmethanes bearing formylgroups (TRAM-CHOs) have been synthesized by the reaction of arenes with aromatic dialdehydes catalyzed by sulfuric acid immobilized on SiO2 under solvent-free grinding conditions in good yields and short grinding time. Secondly, condensation of TRAM-CHOs with several arenes proceeded rapidly within a few minutes to afford the new corresponding mixed-bistriarylmethanes