Organometallic compounds, processes for the preparation thereof and methods of use thereof
申请人:Thompson M. David
公开号:US20080081127A1
公开(公告)日:2008-04-03
This invention relates to organometallic compounds represented by the formula (L
1
)
y
M(L
2
)
z-y
wherein M is a Group 5 metal or a Group 6 metal, L
1
is a substituted or unsubstituted anionic 6 electron donor ligand, L
2
is the same or different and is (i) a substituted or unsubstituted anionic 2 electron donor ligand, (ii) a substituted or unsubstituted cationic 2 electron donor ligand, or (iii) a substituted or unsubstituted neutral 2 electron donor ligand; y is an integer of 1, and z is the valence of M; and wherein the sum of the oxidation number of M and the electric charges of L
1
and L
2
is equal to
0
.; a process for producing the organometallic compounds; and a method for depositing a metal and/or metal carbide/nitride layer, e.g., a tungsten, tungsten nitride, tungsten carbide, or tungsten carbonitride layer, on a substrate by the thermal or plasma enhanced dissociation of the organometallic precursor compounds, e.g., by CVD or ALD techniques. The metal and/or metal carbide layer is useful as a liner or barrier layer for conducting metals and high dielectric constant materials in integrated circuit manufacturing.
该发明涉及由下式表示的有机金属化合物(L1)yM(L2)z-y,其中M是第5族金属或第6族金属,L1是取代或未取代的带负电的6电子给体配体,L2相同或不同,是(i)取代或未取代的带负电的2电子给体配体,(ii)取代或未取代的带正电的2电子给体配体,或(iii)取代或未取代的中性2电子给体配体;y是1的整数,z是M的化合价;其中M的氧化数和L1和L2的电荷之和等于0;一种生产有机金属化合物的方法;以及通过热或等离子增强分解有机金属前体化合物,在基底上沉积金属和/或金属碳化物/氮化物层,例如钨、钨氮化物、钨碳化物或钨碳氮化物层的方法,例如通过化学气相沉积或原子层沉积技术。金属和/或金属碳化物层可用作集成电路制造中导电金属和高介电常数材料的衬底或屏障层。