A resin composition is provided. The resin composition comprises the following components:
(a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I),
wherein M1 and the Z1 groups are as defined in the specification; and
(b) an organic compound of the following formula (II) or formula (III),
wherein R′, R11 to R19 and R21 to R28 are as defined in the specification,
and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).
提供一种
树脂组合物。该
树脂组合物由以下成分组成:
(a) 热固化
树脂体系,该体系在 10 千兆赫时的介电损耗(Df)不高于 0.008,由下式(I)的双马来
酰亚胺树脂组成、
其中 M1 和 Z1 基团如说明书中所定义;以及
(b) 下式(II)或式(III)的有机化合物、
其中 R′、R11 至 R19 和 R21 至 R28 如说明书中所定义、
其中有机化合物(b)的量为
树脂体系(a)和有机化合物(b)总重量的 1 wt % 至 30 wt %。