申请人:——
公开号:US20020013487A1
公开(公告)日:2002-01-31
This invention is directed to a group of novel homologous eight membered ring compounds having a metal, such as copper, reversibly bound in the ring and containing carbon, nitrogen, silicon and/or other metals. A structural representation of the compounds of this invention is shown below:
1
wherein M and M′ are each a metal such as Cu, Ag, Au and Ir; X and X′ can be N or O; Y and Y′ can be Si, C; Sn, Ge, or B; and Z and Z′ can be C, N, or O. Substituents represented by R1, R2, R3, R4, R5, R6, R1′, R2′, R3′, R4′, R5′, and R6′ will vary depending on the ring atom to which they are attached. This invention is also directed to depositing metal and metal-containing films on a substrate, under ALD or CVD conditions, using the above novel compounds as precursors.
本发明涉及一组新型同源的八元环化合物,其中含有金属(例如铜)可逆地结合在环中,并含有碳、氮、硅和/或其他金属。该发明化合物的结构表示如下:1其中M和M'均为金属,如Cu、Ag、Au和Ir;X和X'可以是N或O;Y和Y'可以是Si、C、Sn、Ge或B;Z和Z'可以是C、N或O。由R1、R2、R3、R4、R5、R6、R1'、R2'、R3'、R4'、R5'和R6'表示的取代基将取决于它们附着的环原子。本发明还涉及使用上述新型化合物作为前体,在ALD或CVD条件下在基底上沉积金属和含金属的薄膜。