申请人:Endo Atsuo
公开号:US20120015300A1
公开(公告)日:2012-01-19
Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (al) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4′-dihydroxy-2,2′-diphenylpropane (C) a quinonediazide group-containing compound