[EN] COMPOSITIONS AND METHODS OF MAKING THIN WALL HOUSINGS FOR ELECTRONIC DEVICES<br/>[FR] COMPOSITIONS ET PROCÉDÉS DE FABRICATION DE BOÎTIERS DE PAROI MINCE POUR DES DISPOSITIFS ÉLECTRONIQUES
申请人:SABIC INNOVATIVE PLASTICS IP
公开号:WO2014138044A1
公开(公告)日:2014-09-12
Provided herein are high flow and ductile thermoplastic resin compositions for the formation of thin wall articles and articles with desirable impact strengths. These compositions are useful in the manufacture of various shaped, formed and/or molded articles.