申请人:BASF SE
                            
                            
                                公开号:US10633516B2
                            
                            
                                公开(公告)日:2020-04-28
                            
                            
The invention relates to the use of thermoplastic molding compositions comprising
A) 30 to 99.99 wt % of a thermoplastic polyamide,
B) 0.01 to 10 wt % of a compound of formula I
where
A) represents a
or —O—R5 radical or
B) represents a
or —O—R6 radical or
and
Z represents linear or branched C1 to C14 alkylene radicals, unsubstituted or substituted cycloalkylene radicals having 3 to 17 carbon atoms, substituted or unsubstituted aromatic radicals having 6 to 20 carbon atoms,
R1 to R10 independently of one another represent linear C1-C14 alkyl radicals, branched C3 to C12 alkyl radicals, unsubstituted or substituted C3-C14 cycloalkyl radicals, unsubstituted or substituted aromatic radicals having 6 to 20 carbon atoms or acetyl radicals,
R1 and R2 and also R3 and R4 independently of one another, together with the nitrogen as a linking member, form a heteroalkylene radical which may bear one or two keto groups as substituent(s).
                            本发明涉及热塑性模塑组合物的使用,该组合物包括
A) 30 至 99.99 wt % 的热塑性聚酰胺、
B) 0.01 至 10 wt % 的式 I 化合物
其中
A) 表示
或-O-R5 自由基或
B) 代表一个
或-O-R6 自由基或
和
Z 代表线性或支链 C1 至 C14 烯基、具有 3 至 17 个碳原子的未取代或取代的环烷基、具有 6 至 20 个碳原子的取代或未取代的芳香基、
R1 至 R10 相互独立地代表线性 C1-C14 烷基、支链 C3 至 C12 烷基、未取代或取代的 C3-C14 环烷基、具有 6 至 20 个碳原子的未取代或取代的芳基或乙酰基、
R1 和 R2 以及彼此独立的 R3 和 R4 与作为连接构件的氮一起形成杂亚烷基,该杂亚烷基可带有一个或两个酮基作为取代基。