申请人:——
公开号:US20030153571A1
公开(公告)日:2003-08-14
A method for the treatment of pain is disclosed comprising administration of a pain-ameliorating effective amount of any compound according to structural diagram I;
1
wherein R
1
, A and D are as defined in the specification. Also disclosed are pharmaceutical compositions comprising a pain-ameliorating effective amount of a compound in accord with structural diagram I.
本发明揭示了一种治疗疼痛的方法,包括给予任何符合结构式I的化合物的缓解疼痛有效剂量,其中R1,A和D如规范中所定义。此外,还揭示了包含符合结构式I的化合物的缓解疼痛有效剂量的药物组合物。