Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1):
The obtained resin may have a unit structure of Formula (2):
Ar
1
and Ar
2
each are C
6-40
aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent.
Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.
高干法蚀刻抗性、抗扭曲性、并对不平整部分表现出良好的平整和嵌入性的抗阻层薄膜形成组合物,包括通过反应含芳香环的有机化合物A和至少有两个芳香族
碳环环团且具有
酚羟基的醛B所获得的
树脂,并具有芳香族
碳环环团通过三级
碳原子键合的结构。醛B可以是化合物式(1)的化合物:所获得的
树脂可以具有式(2)的单元结构:其中Ar1和Ar2各自是C6-40芳基团。含芳香环的有机化合物A可以是芳香胺或含
酚羟基的化合物。该组合物还可以含有溶剂、酸和/或酸发生剂,或
交联剂。用于半导体生产的形成光刻图形,包括将抗阻层薄膜形成组合物涂覆在半导体基板上并烘烤以形成抗阻层薄膜。